Electronics Manufacturing and Design Engineering
  • Thru-hole and Surface Mount Technology
  • Electro-Mechanical Assembly "box build"
  • Design Engineering
  • Industrial Design
    		•

    Manufacturing Capabilities

    • New Lean manufacturing facility
    • Automated surface mount technology and through hole board assembly
    • Singe sided, double-sided, and multi-layered board designs
    • Cable, box build and final system integration
    • Capable of producing from 1 to 99,000 units
    • Functional, manufacturing defects analyzer (MDA), and automated optical inspection testing
    • Simple to highly complex turns
    • Comprehensive enterprise resource planning materials management system
    • Work in process tracking
    • Barcode identification and serialization
    • Ship to your end customer
    • Strong financial position allows for immediate expansion
    © Pinnacle Technology Group, Inc. 2006 | Contact Us | Site Map
    7076 Schnipke Drive, Ottawa Lake, MI 49267
    800-345-5123