Pinnacle Electronic Manufacturing
Experience, quality, efficiency, attention to detail, and excellent service are attributes that our customers have come to expect from Pinnacle. We take pride in our ability to help our customers from concept to completion. Pinnacle is committed to drive and manage a successful partnership built around you. We do this by establishing a pathway for optimizing your specialty product design and manufacturing to increase speed to market, profitability, and customer usage.
Our Electronics Manufacturing and Design Engineering Capabilities include:
- Thru-hole and Surface Mount Technology
- Electro-Mechanical Assembly “box build”
- Design Engineering
- Industrial Design
Pinnacle is very versatile when it comes to manufacturing circuit boards, and is extremely experienced in many different manufacturing processes. Our SMT machines make it easy for us to place surface mount parts with great accuracy and quality. Our machine capabilities can handle 0402mm component sizes, Ball Grid Array’s and Micro Ball Grid Array’s with a ball pitch of 1mm to 3mm. Many of our Thru-Hole operations are automated through the use of robotic axial equipment. No project is too small or too large; Pinnacle can handle boards with a thickness of 0.4mm to 4mm, board area sizes from 16in. x 14in. and a minimum of 2in. x 1in., Rigid-Flex Assemblies, and 10-12 layer circuit boards.
In addition, have experienced employees who are qualified to do any hand assembly required, as well as 100% inspection. Some of our value added services include, box builds, functional testing, conformal coating, automated optical inspection, and manufacturing defect analysis.